Smarter Systems Through Heterogeneous Integration. Menta & CEA-Leti will present together the MOSAICS-LP project, a scalable chiplet platform targeting the edge computing market. Based on a universal interconnection backbone, computing chiplet and advanced packaging schemes, the platform enables a multi-source chiplet ecosystem.

The global economy is sending mixed messages, and with every new data release comes a new batch of upbeat or defeatist headlines.
Uncertainty remains if inflation is fully under control and how quickly economic growth will pick up strongly again. On one side the labor market seems healthier than it’s been in years, on the other all major tech companies have announced significant layoffs. The chip shortage is not over yet in some segments, but in some others there is excess supply. Our new multipolar world order will enforce structural changes to the economy, such as the need to rebuild reliable supply chains closer to home, which often comes at higher prices.
Despite these uncertainties, innovation in our industry remains as strong as ever, with relentless growth driven by automotive, 5G and next generation connectivity, new silicon design paradigms including RISC-V and chiplets, big trends towards decarbonization and new materials like SiC, the positive effects of increased diversity and inclusion. And large amounts of government money is made available globally to support this growth, through “chips acts” and “green deals”.
There is therefore a strong belief that tech innovation and growth will continue to prevail and, with a little more positive international cooperation, deal with the apparent challenges altogether.

GOMACTech was established primarily to review developments in microcircuit applications for government systems. Established in 1968, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies and has been used to announce major government microelectronics initiatives such as VHSIC and MIMIC, and provides a forum for government reviews.

The embedded world Exhibition&Conference provides a global platform and a place to meet for the entire embedded community, including leading experts, key players and industry associations. It offers unprecedented insight into the world of embedded systems, from components and modules to operating systems, hardware and software design, M2M communication, services, and various issues related to complex system design.
Its expertise and sharp focus on technologies, processes and future-oriented products make it unparalleled in international comparisons – and THE must-attend event for developers, system architects, product managers and technical management.

The HiPEAC conference is the premier European forum for experts in computer architecture, programming models, compilers and operating systems for general-purpose, embedded and cyber-physical systems. Areas of focus and integration include safety-critical dependencies, cybersecurity, energy efficiency and machine learning.
The HiPEAC 2023 conference will take place in Toulouse, France. Associated workshops, tutorials, special sessions, several large poster session and an industrial exhibition will run in parallel with the conference. Menta will give a talk in the Workshop F4HD The Future of FPGAs in HPC and Datacenters: https://sites.google.com/view/f4hd

The RISC-V in Space Workshop is organized by the ESA Microelectronics Section. The objective is to stimulate the exchange between different parties in Europe, providing or developing space specific microprocessors, IP cores or software solutions based on the RISC-V Instruction Set Architecture.

IP-SoC 2022 will be the 25th edition of the working conference fully dedicated to IP (Silicon Intellectual Property) and IP based electronic systems.
The event is the annual opportunity for IP providers and IP consumers to share information about technology trends, innovative IP SoC products, Breaking IP/SoC News, Market evolution and more.
The Grenoble event is a special event as it is also the annual IP Think Tank meeting where high level executives, market analyzer and technical experts in all the design track from Foundry, technology, design methodology, EDA tools share their vision about the future of the IP concept. It will be the right time to analyze the fast evolution and consolidation in the IP market and IP business.

The unique B2B event on the convergence of IOT, AI, ROBOTIC & XR Technologies.
SIDO is the link between technological solutions and VSEs, SMEs, ETIs and large groups by facilitating technological partnerships and cooperation. SIDO is THE meeting place for all business leaders, strategic decision-makers, innovators, and all operational staff in search of long-term growth and value creation.

The IC industry continues to grow thanks to the Systems, Automotive and Technology unicorns venturing to design their own chips and well-established IC companies and start-ups bringing in new innovations and chip architectures. While there are a lot of new designs and architectures, we continue to evolve in how we design, verify, and validate theses new architectures, constantly thriving to shift left to shrink our project schedules while ensuring the designs comply with the various standards for safety and security. This year’s edition will have a good mix of Vision and Keynote talks, lively panel discussions spread across both the days and with tutorials and short workshops on Day 1 and papers and posters on Day 2.

Whether it's the safety of electronic systems, distributed intelligence, the Internet of Things or e-mobility and energy efficiency – the embedded world trade fair lets you experience the whole world of embedded systems. Discover the innovations of the embedded sector, meet experts and win new customers. Embedded world offers the entire spectrum – from components, modules and complete systems to operating systems, hardware and software and services.

The Design Automation Conference (DAC) is recognized as the premier event for the design and design automation of electronic chips to systems. DAC offers outstanding training, education, exhibits and superb networking opportunities for designers, researchers, tool developers and vendors. The conference is sponsored by the Association for Computing Machinery (ACM) and the Institute of Electrical and Electronics Engineers (IEEE) and is supported by ACM's Special Interest Group on Design Automation (SIGDA) and IEEE's Council on Electronic Design Automation (CEDA).

The largest annual event of the Israeli Semiconductor Industry